- Polyimide,Polyester,Adhesiveless technology
- Stiffener FR4,Polyimide
- ENIG (lmmersion Au), LF HAL,HASL, Immersion Sn, Immersion Ag, OSP
- Bond Au, Selective Au, Connectors. Buttons etc.
- Most of all colours of soldermask and legend
- Copper thickness from 12um
- Board thickness from 20um
- 1-4 layers
- Impedance control and verification
- CAM,DFM,Panel optimization, Product criticism
- Qc(Quality control) by Gscso with attached report document
- IPC Class ll and III
- FR4,Polyimide,Polyester,Adhesiveless technology, RCC
- ENIG(Immersion Au),LF HAL，HASL, Immersion Sn, Immersion Ag, OSP
- Bond Au, Selective Au, Connectors, Buttons etc.
- Most of all colours of soldermask and legend
- Copper thickness 18-500um
- Board thickness 0.012-6.0mm
- 1-40 layers
- Blind, buried, stacked vias
- Resin/copper filled blind via, sequential build-up
- Impedance control and verification
- CAM，DFM, Panel optimization,Product criticism
- Qc (Quality control) by Gscso with attached report document
- IPC Class ll and III
- FR4, High Tg, Halogen free
- ENIG (Immersion Au), LF HAL, HASL, Immersion Sn, Immersion Ag, OSP
- Bond Au, Selective Au, Connectors, Buttons etc.
- Most of all colours of soldermask and legend
- Copper thickness 18-500um
- Board thickness 0.2-6.0mm
- 1-44 layers
- Impedance control and verification
- CAM, DFM, Panel optimization, Product criticism
- QC (Quality control) by GSCSO with attached report document
- IPC Class II and III
- Rogers, Bergquist, Arlon, Chin-Shi, Chaoshun etc.
- ENIG (Immersion Au), LF HAL, HASL, Immersion Sn, Immersion Ag, OSP
- Bond Au, Selective Au, Connectors, Buttons etc.
- Most of all colours of soldermask and legend
- Copper thickness 12-300um
- Board thickness 0.5-6.0mm (0.23 for UTC)
- 1-2 layers
- CAM, DFM, Panel optimization, Product criticism
- QC (Quality control) by GSCSO with attached report document
- IPC Class II and III
- FR4, High Tg, Halogen free, RCC-foil
- ENIG (Immersion Au), LF HAL, HASL, Immersion Sn, Immersion Ag, OSP
- Bond Au, Selective Au, Connectors, Buttons etc.
- Most of all colours of soldermask and legend
- Copper thickness 18-500um
- Board thickness 0.3-6.0mm
- 4-40 layers
- Blind, Buried, Stacked vias and back drilling
- Resin/copper filled blind vias, sequential build-up
- Impedance control and verification
- CAM, DFM, Panel optimization, Product criticism
- QC (Quality control) by GSCSO with attached report document
- IPC Class II and III
- On the market used materials, Rogers, Neltec, Arlon, Taconic etc.
- ENIG (Immersion Au), LF HAL, HASL, Immersion Sn, Immersion Ag, OSP
- Bond Au, Selective Au, Connectors, Buttons etc.
- Most of all colours of soldermask and legend
- Copper thickness 18-500um
- Board thickness 0.2-6.0mm
- 1-20 layers
- Blind, buried, stacked vias
- Resin/copper filled blind via, sequential build-up
- Impedance control and verification
- CAM, DFM, Panel optimization, Product criticism
- QC (Quality control) by GSCSO with attached report document
- IPC Class II and III
